Everything a phone engineer has to know
From flux and hot air on a dead logic board to LPDDR stack-ups, RF front ends and the secure boot chain. Two complete tracks — repair technician and design engineer — with a short video tutorial attached to every single lesson.
What the curriculum covers
Bench & board repair
Diagnostics, micro-soldering, BGA rework, pad and trace rebuilds.
Power & charging
Power trees, USB-PD, fuel gauging, no-power algorithms.
RF & antennas
Baseband, front-end modules, antenna tuning and no-service faults.
Silicon & PCB
SoC architecture, HDI stack-ups, signal and power integrity.
Boot chain & platform
Secure boot, drivers, Android/iOS internals, flashing and locks.
Video for every lesson
Each lesson links a curated short tutorial to watch alongside.
The two tracks
Bench work, board-level repair and service software
Repair Technician Track
Everything a working phone engineer needs at the repair bench: diagnostics, teardown, micro-soldering, power and charging faults, display and camera work, radio and audio, plus the service-software side — flashing, IMEI, activation locks and data recovery.
- ▸1. Bench, Tools & Safety — Set up a bench that does not destroy the boards you are paid to save.
- ▸2. Phone Anatomy & Teardown — Know every part, what it does, and how it comes apart.
- ▸3. Electronics & Measurement — The physics and instruments underneath every repair decision.
- ▸4. Micro-soldering & Board Repair — Hands-on rework: components, BGAs, pads and traces.
- ▸5. Power, Charging & Battery — The single largest source of real-world repair tickets.
- ▸6. Display, Touch, Camera & Audio — The visible subsystems the customer judges you on.
- ▸7. Radio, Antennas & Connectivity — Cellular, Wi-Fi, GNSS, NFC and the faults that kill signal.
- ▸8. Service Software & Data — Flashing, recovery, locks, data extraction and the legal boundaries.
Silicon, PCB, RF, power, firmware and platform software
Design Engineer Track
The R&D side of phone engineering: how a handset is architected and built. SoC and memory architecture, HDI PCB design, power delivery and battery systems, RF and antenna engineering, imaging and sensors, the secure boot chain, Android/iOS platform internals, and the manufacturing, reliability and certification work that ships a product.
- ▸1. Silicon & System Architecture — How a handset is organised from the SoC outwards.
- ▸2. PCB & Interconnect Design — HDI stack-ups, signal integrity and layout rules for handsets.
- ▸3. Power Delivery & Battery Systems — Designing the power tree, charging and the BMS.
- ▸4. RF, Antennas & Cellular Systems — From baseband algorithms to metal in the frame.
- ▸5. Display, Imaging & Sensors — The subsystems users perceive as the product.
- ▸6. Firmware & The Boot Chain — From power-on reset to a running kernel, securely.
- ▸7. Platform & Application Software — Android and iOS internals a device engineer must know.
- ▸8. Manufacturing, Reliability & Compliance — Turning a working prototype into a million shipped units.